Increasing yield in ofets by using a high-k dielectric layer in a dual dielectric layer

ABSTRACT

Dielectric layer pinholes in OFET structures are addressed through the addition of a high-K dielectric layer to eliminate the effects of shorts in the dielectric layer. The original dielectric layer is maintained such that the semiconductor/dielectric interface remains unchanged. The high-K dielectric layer contributes material to the gate dielectric to plug up pinholes in the original dielectric, but does not contribute significant capacitance due to the high dielectric constant of the additional dielectric layer. The incidence of pinholes in the dielectric layer is reduced without significantly affecting the performance of the OFET transistor.

FIELD OF THE INVENTION

The present invention relates to Organic FETs (“OFETs”), and, moreparticularly, to the use of a second, high-K dielectric layer inaddition to a first, low-K dielectric layer in an OFET structure toimprove reliability and yield without adversely affecting performance.

BACKGROUND OF THE INVENTION

The performance of an OFET structure is generally improved when thecapacitance between the gate and the channel increases. This can beachieved by making the dielectric layer between the gate and channel asthin as possible. However, as the dielectric layer is made thinner,there is an increased probability of shorting between the firstconductor source/drain layer and the second conductor gate layer causedby an increased likelihood of pinholes in the thinner dielectric.

Such pinholes are particularly prevalent in polymer dielectric layersand will inadvertently permit shorting of a first layer conductor to asecond layer conductor in the OFET. In the prior art, the dielectriclayer can be increased in thickness or deposited a second time in orderto reduce incidences of these pinholes. However, both of theseapproaches undesirably result in a thicker gate dielectric layer,significantly decreasing the performance of the transistor. In the priorart, dielectric layer might alternatively be replaced with a high-Kdielectric layer. When the dielectric constant of the dielectric layeris increased, a comparable gate capacitance is achieved with a thickerdielectric layer. However, dielectric compatibility with the organicsemiconductor is crucial in OFET devices. High-performing organicsemiconductors tend to be compatible only with low-K dielectrics.

What is desired, therefore, is an OFET-compatible fabrication method andcorresponding OFET structure for reducing the probability of pinholeswithout significantly changing the capacitance between gate and channel.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other objects, features and advantages of theinvention will become more readily apparent from the following detaileddescription of preferred embodiments of the invention, which proceedwith reference to the accompanying drawings, wherein:

FIGS. 1-6 are sequential cross-sectional diagrams of a top gate OFETstructure having a dual dielectric layer according to the presentinvention;

FIG. 7 is a cross-sectional diagram of a bottom gate/bottom contact OFETstructure having a dual dielectric layer according to the presentinvention; and

FIG. 8 is a cross-sectional diagram of a bottom gate/top contactstructure having a dual dielectric layer according to the presentinvention.

DETAILED DESCRIPTION

According to the present invention, an OFET fabrication method providesa solution to the pinhole problem discussed above by depositing a secondlayer on top of the original dielectric layer, wherein the seconddielectric layer has a significantly higher dielectric constant thanthat of the original dielectric constant layer. A dielectric layer witha high dielectric constant is referred to as a “high-K dielectriclayer”. Electrically, the dual dielectric structure of the presentinvention can be thought of as a high-K dielectric capacitor in serieswith a low-K dielectric capacitor. In such a circuit configuration, thecontribution of the high-K dielectric capacitor to the overallcapacitance of the dual structure is minimal. Therefore, though theoverall thickness of the dual dielectric structure is increased, thecapacitance remains substantially unchanged. Consequently, pinholedensity and the probability of shorts is decreased while not adverselyaffecting the performance of the dual-gate dielectric device.

High-K materials generally have high leakage, which make them unsuitableas a gate dielectric layer in an OFET structure. However, in theproposed structure according to the present invention, the low-Kdielectric capacitance is in series with the high-K dielectriccapacitance. Therefore, the overall leakage current is dominated by theoriginal low-K dielectric layer. The high leakage current associatedwith the high-K materials will therefore not play a significant role indetermining the total amount of leakage current.

High-K materials also tend to have a poor semiconductor/dielectricinterface, producing poor OFET characteristics. However, in the proposedstructure according to the present invention, the semiconductor layerinterfaces with the low-K dielectric layer. Therefore, the interfaceproperties of the dual structure are the same as the state-of-the-artsingle-dielectric structure.

The dielectric layer pinholes in prior art OFET structures are addressedthrough the addition of a high-K dielectric layer to eliminate theeffects of shorts in the dielectric layer. In the claimed structure, theoriginal dielectric layer is maintained such that thesemiconductor/dielectric interface remains unchanged. The high-Kdielectric layer contributes material to the gate dielectric to plug uppinholes in the original dielectric, but does not contribute significantcapacitance due to the high dielectric constant of the additionaldielectric layer. Thereby, the incidence of pinholes in the dielectriclayer is reduced without significantly affecting the performance of theOFET transistor.

In a first embodiment of the invention, a top gate OFET having a dualdielectric layer includes a patterned first conductive layer on aninsulating substrate forming source and drain contacts, a semiconductorlayer in a channel region between the source and drain contacts, a firstdielectric layer over the semiconductor layer in at least the channelregion as well as any unconnected first level metal areas, a seconddielectric layer over the first dielectric layer in at least the channelregion as well as any unconnected first level metal areas, and apatterned second conductive layer on the second dielectric layer overthe channel region, wherein the second dielectric layer has a dielectricconstant higher than that of the first dielectric layer.

In a second embodiment of the invention, a bottom-gate/bottom-contactOFET structure having a dual dielectric layer includes a patterned firstconductive layer on an insulating substrate, a first dielectric layerover the patterned first conductive layer, a second dielectric layerover the first dielectric layer, a patterned second conductive layer onthe second dielectric layer forming source and drain contacts, and anorganic semiconductor layer in a channel region between the source anddrain contacts, wherein the second dielectric layer has a dielectricconstant higher than that of the first dielectric layer.

In a third embodiment of the invention, a bottom-gate/bottom-contactOFET structure having a dual dielectric layer includes a patterned firstconductive layer on an insulating substrate, a first dielectric layerover the patterned first conductive layer, a second dielectric layerover the first dielectric layer, an organic semiconductor layer over thesecond dielectric layer, and a patterned second conductive layer onorganic semiconductor layer forming source and drain contacts, whereinthe second dielectric layer has a dielectric constant higher than thatof the first dielectric layer.

In the embodiments of the present invention, the insulating substrateincludes PET, PEN, glass, or Kapton. The first conductive layer includesconductive organic materials such as PEDOT and carbon black, ornano-particle solutions or pre-cursors of inorganic materials such asgold, silver, titanium, aluminum, or silicon. The semiconductor layerincludes an organic semiconductor such as polythiophene orsolution-based pentacene, or a solution-based inorganic semiconductor inthe form of a precursor solution or suspended nanoparticles such assilicon or gallium arsenide. The first dielectric layer includes organicmaterials such as polyvinylphenol PVP and derivatives PNP-CPC andPVP-CL, poly(3,4-ethylenedioythiophene), PVA, or CYPEL. Ideally, thefirst dielectric layer has a dielectric constant less than four. Thesecond dielectric layer includes ferroelectric polymers, or siliconnitride or inorganic materials in the form of a precursor solution orsuspended nanoparticles such as silicon dioxide, titanium dioxide, oraluminum oxide. Ideally, the second dielectric layer has a dielectricconstant greater than four. The second conductive layer includesnano-particle silver, a conductive polymer, flake-based silver inks,gold, zinc, or aluminum nanoparticles.

The process sequence for a top gate OFET structure having a dualdielectric layer according to the present invention is shown in FIGS.1-6.

In FIG. 1 the source and drain of the OFET is deposited. A firstconductor layer is deposited and patterned on insulating substrate 112to form source 118 and drain 116. The patterned conductor layer can beformed conductive organic materials such as PEDOT and carbon black, ornano-particle solutions or pre-cursors of inorganic materials such asgold, silver, titanium, aluminum, or silicon.

In FIG. 2, the semiconductor layer 114 is deposited in the channelregion 124 between source 118 and drain 116, and overlaps at least inpart source 118 and drain 116. The semiconductor layer 114 is depositedand patterned such that at minimum the semiconductor exists between thesource 118 and drain 116 in the channel region 124. The semiconductorlayer is formed by an organic semiconductor such as polythiophene orsolution-based pentacene, or a solution-based inorganic semiconductor inthe form of a precursor solution or suspended nanoparticles such assilicon or gallium arsenide.

In FIG. 3, a low-K dielectric layer 120 is deposited over the organicsemiconductor layer 114. At a minimum, the low-K dielectric layer 120should cover the channel region 124 of the OFET (region between source118 and drain 116), and must cover all areas on the first conductorlayer (the layer used to form source 118 and drain 116) that are not tobe connected to a subsequently formed second conductor layer. Low-Kdielectric layer 120 is formed by polyvinylphenol PVP and derivativesPNP-CPC and PVP-CL, poly(3,4-ethylenedioythiophene), PVA, or CYPEL.

In FIG. 4, a pinhole 126 in the low-K dielectric layer 120 is shown.Such pinholes as pinhole 126 could result from air in the ink duringagitation, or perhaps because the ink was not properly outgassed beforeprinting. Pinholes could also result due to an imperfection in theunderlying layer causing wetting issues of the dielectric ink, leavingan opening. The pinhole could also occur during an anneal or dryingprocess as the solvent is evaporating. Alternatively, such a pinhole 126could result from particles in the ink or on the deposition surface. Thepinhole 126 could go through only the dielectric layer 120 as shown inFIG. 4, and contact the semiconductor layer 114. Alternatively, thepinhole 126 could line up with another pinhole in the semiconductorlayer 114 (second pinhole not shown in FIG. 4), shorting the two metallayers (specifically, the source as shown in FIG. 4 to the second metallayer, not yet formed in FIG. 4) together.

In FIG. 5, the high-K dielectric 128 is deposited and patterned on thesurface of the low-K dielectric layer 120. The high-K dielectric layer128 is used to plug any pinholes 126 that may exist in the underlyingdielectric layer 120 and/or semiconductor layer 114. As previouslynoted, the high-K dielectric layer 128 could be a ferroelectric polymer.The high-K dielectric layer 128 is formed by ferroelectric polymers, orsilicon nitride or inorganic materials in the form of a precursorsolution or suspended nanoparticles such as silicon dioxide, titaniumdioxide, or aluminum oxide.

In FIG. 6, a second metal layer 122 is deposited and patterned to formthe gate conductor 122. The gate conductor 122 ideally resides over thechannel region 124 of the OFET (between the source 118 and drain 116).The gate conductor may overlap the source and drain.

FIGS. 1-6 complete the process flow of the dual high-K/low-K dielectrictop gate process to form an OFET according to a first embodiment of thepresent invention. The dual high-K/low-K dielectric layer structure canalso be inserted into other OFET transistor structures according to thepresent invention. The final result of these other structure options areillustrated in a cross-sectional diagram in FIGS. 7 and 8, although theindividual process steps are not. The materials and methods describedabove and shown in FIGS. 1-6 for forming the individual layers can bereused for the OFETs shown in FIGS. 7 and 8. With respect to FIGS. 1-8,patterning of various layers can be achieved additively by depositingsolution-based inks using print techniques such as inkjet, gravure,flexography, screen printing, letter press, or off-set lithography.Alternatively, an unpatterned solid layer can be deposited followed by asubtractive step such as a photo-defined resist pattern, followed by anetch of the material or by dry removal techniques such as laserablation.

In FIG. 7, a bottom gate/bottom contact OFET structure 700 with a high-Kdielectric layer according to the present invention is shown. OFET 700includes an insulating substrate layer 702, a first patterned metallayer 704 forming the gate of the OFET, a low-K dielectric layer 706covering the metal gate layer 704, a high-K dielectric layer 708 formedover the low-K dielectric layer 706, a second patterned metal layerforming the source 710 and drain 712 of the OFET, and an organicsemiconductor layer 714 formed over the source 710 and drain 712.

In FIG. 8, a bottom gate/top contact OFET structure 800 with a high-Kdielectric layer according to the present invention is shown. OFET 800includes an insulating substrate layer 802, a first patterned metallayer 804 forming the gate of the OFET, a low-K dielectric layer 806covering the metal gate layer 804, a high-K dielectric layer 808 formedover the low-K dielectric layer 806, an organic semiconductor layer 814formed over high-K dielectric layer 808, and a second patterned metallayer forming the source 810 and drain 812 of the OFET.

Having described and illustrated the principle of the invention in apreferred embodiment thereof, it is appreciated by those having skill inthe art that the invention can be modified in arrangement and detailwithout departing from such principles. Although a preferred method andcircuit has been shown, the exact details of the preferred method andcircuit can be changed as desired as required for a particularapplication. We therefore claim all modifications and variations comingwithin the spirit and scope of the following claims.

1. A method of fabricating an OFET having a dual dielectric layercomprising: providing a patterned first conductive layer on aninsulating substrate to form source and drain contacts; providing asemiconductor layer such that, at a minimum, the semiconductor layerexists in a channel region between the source and drain contacts;providing a first dielectric layer over the semiconductor layer in atleast the channel region as well as any unconnected first level metalareas; providing a second dielectric layer over the first dielectriclayer in at least the channel region as well as any unconnected firstlevel metal areas; and providing a patterned second conductive layer onthe second dielectric layer over the channel region, wherein the seconddielectric layer has a dielectric constant higher than that of the firstdielectric layer.
 2. The method of claim 1 wherein the insulatingsubstrate comprises: PET, PEN, glass, or Kapton.
 3. The method of claim1 wherein the first conductive layer comprises conductive organicmaterials such as PEDOT and carbon black, or nano-particle solutions orpre-cursors of inorganic materials such as gold, silver, titanium,aluminum, or silicon.
 4. The method of claim 1 wherein the semiconductorlayer comprises an organic semiconductor such as polythiophene orsolution-based pentacene, or a solution-based inorganic semiconductor inthe form of a precursor solution or suspended nanoparticles such assilicon or gallium arsenide.
 5. The method of claim 1 wherein the firstdielectric layer comprises organic materials such as polyvinylphenol PVPand derivatives PNP-CPC and PVP-CL, poly(3,4-ethylenedioythiophene),PVA, or CYPEL.
 6. The method of claim 1 wherein the first dielectriclayer comprises a dielectric constant less than four.
 7. The method ofclaim 1 wherein the second dielectric layer comprises ferroelectricpolymers, or silicon nitride or inorganic materials in the form of aprecursor solution or suspended nanoparticles such as silicon dioxide,titanium dioxide, or aluminum oxide.
 8. The method of claim 1 whereinthe second dielectric layer comprises a dielectric constant greater thanfour.
 9. The method of claim 1 wherein the second conductive layercomprises nano-particle silver, a conductive polymer, flake-based silverinks, gold, zinc, or aluminum nanoparticles.
 10. An OFET having a dualdielectric layer comprising: a patterned first conductive layer on aninsulating substrate forming source and drain contacts; a semiconductorlayer in a channel region between the source and drain contacts; a firstdielectric layer over the semiconductor layer in at least the channelregion as well as any unconnected first level metal areas; a seconddielectric layer over the first dielectric layer in at least the channelregion as well as any unconnected first level metal areas; and apatterned second conductive layer on the second dielectric layer overthe channel region, wherein the second dielectric layer has a dielectricconstant higher than that of the first dielectric layer.
 11. The OFET ofclaim 10 wherein the insulating substrate comprises PET, PEN, glass, orKapton.
 12. The OFET of claim 10 wherein the first conductive layercomprises conductive organic materials such as PEDOT and carbon black,or nano-particle solutions or pre-cursors of inorganic materials such asgold, silver, titanium, aluminum, or silicon.
 13. The OFET of claim 10wherein the semiconductor layer comprises an organic semiconductor suchas polythiophene or solution-based pentacene, or a solution-basedinorganic semiconductor in the form of a precursor solution or suspendednanoparticles such as silicon or gallium arsenide.
 14. The OFET of claim10 wherein the first dielectric layer comprises organic materials suchas polyvinylphenol PVP and derivatives PNP-CPC and PVP-CL,poly(3,4-ethylenedioythiophene), PVA, or CYPEL.
 15. The OFET of claim 10wherein the first dielectric layer comprises a dielectric constant lessthan four.
 16. The OFET of claim 10 wherein the second dielectric layercomprises ferroelectric polymers, or silicon nitride or inorganicmaterials in the form of a precursor solution or suspended nanoparticlessuch as silicon dioxide, titanium dioxide, or aluminum oxide.
 17. TheOFET of claim 10 wherein the second dielectric layer comprises adielectric constant greater than four.
 18. The OFET of claim 10 whereinthe second conductive layer comprises nano-particle silver, a conductivepolymer, flake-based silver inks, gold, zinc, or aluminum nanoparticles.19. A bottom-gate/bottom-contact OFET structure having a dual dielectriclayer comprising: a patterned first conductive layer on an insulatingsubstrate; a first dielectric layer over the patterned first conductivelayer; a second dielectric layer over the first dielectric layer; apatterned second conductive layer on the second dielectric layer formingsource and drain contacts; and an organic semiconductor layer in achannel region between the source and drain contacts, wherein the seconddielectric layer has a dielectric constant higher than that of the firstdielectric layer.
 20. A bottom-gate/bottom-contact OFET structure havinga dual dielectric layer comprising: a patterned first conductive layeron an insulating substrate; a first dielectric layer over the patternedfirst conductive layer; a second dielectric layer over the firstdielectric layer; an organic semiconductor layer over the seconddielectric layer; and a patterned second conductive layer on an organicsemiconductor layer forming source and drain contacts, wherein thesecond dielectric layer has a dielectric constant higher than that ofthe first dielectric layer.